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TLOH9204
TOSHIBA LED LAMP InGaAlP ORANGE LIGHT EMISSION
TLOH9204
AF auxiliary light source for digital still cameras Red-eye reduction lamp Lead(Pb)-Free
* * * * * Surface-mount and transparent epoxy package Compact size Narrow radiation pattern Radiation angle: 1/2=4 High optical axis accuracy with excellent position accuracy of the emitting part. InGaAlP ultra-high brightness chip Emission color: Orange P=612nm(typ.) On-axis luminous intensity : IV=21cd(typ) * Low forward voltage : VF=2V (typ.) @IF=20mA, Ta=25 @IF=20mA, Ta=25
(Unless Otherwise Specified ,Ta = 25)
Characteristics Forward current Reverse voltage Forward current derating (Ta>60) Operating temperature range Storage temperature range Soldering temperature range (5s) (Note 1) Symbol IF VR IF/ Topr Tstg Tsol Rating 50 5 -1.25 -25~85 -40~100 245(Note 2) Unit mA V mA/
Absolute Maximum Ratings
TOSHIBA
4-5AW1
Weight: 0.1 g (typ.)
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Continuous operation time is 13h or less,Ta=60 Note 2:The reflow time and recommended temperature profile are shown in the section entitled Handling Precautions.
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Electrical and Optical Characteristics (Ta = 25)
Characteristics Forward voltage Reverse current Luminous intensity(On-axis)(Note 3) Peak emission wavelength Spectrum half wavelength Optical axis deviation (Note 3) Half-angle value (Note 3) Symbol VF IR IV p 1/2 IF=20mA VR = 5 V IF=20mA IF=20mA IF=20mA IF=20mA IF=20mA Test Condition Min 15 Typ. 2 21 612 15 Max 2.4 50 3 Unit V A cd nm nm
4
Note 3: The standard surface of measurement is the shaded area in Figure 2.
Precaution
* The TLOH9204 is intended for digital still camera use only. Please do not use the device for any other purpose. * Do not apply any mechanical stress to the device while the device's temperature is high. * Soldering must be performed in the shaded area as shown in Figure 1 below. * The recommended standard mounting surface for this LED is the shaded area shown in Figure 2 below.
Figure 1
Figure 2
Device appearance: Since this device is cast in resin, air bubbles, cracks, etc. may occur due to variations in manufacture. Please ask our sales section for details of appearance standards for the device. (Examples of variations in device appearance) Air bubbles: Spherical air bubbles inside the resin Cracks : Linear crack in the package surface
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Package Dimensions
Unit: mm Tolerance: 0.1 () : Reference value

1.27
Weight: 0.1 g (typ.)
Pin connection
2 5 2. Anode 5. Cathode Other pins: NC
0.9
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Handling Precautions Moisture-Proof Packing
(1) To avoid moisture absorption by the resin, the product is packed in an aluminum envelope with silica gel and moisture indicator. (2) The optical characteristics of the device can be affected during soldering by vaporization resulting from prior absorption of moisture. Conditions for storing and handling the device are as follows: 1. Storage period is 6 months after the seal date when the package remains unopened. The seal date is printed on the label. 2.Conditions after opening: Temperature: 5deg to 30 deg, Relative humidity:70%(max), Time:48h(max) 3.Baking in tape reel is required if the devices have been store unopened for more than 6 months, or if the aluminum envelope has been opened for more than 48h, or the moisture indicator card shows humidity of 30% or above (the indicator color changes to pink). These devices are packed on tapes; hence, avoid baking at high temperature. Recommended baking conditions: 60deg for 48h or longer. Perform baking only once. Use within 3 hours of baking. 4. Repeat baking may cause the tape strength change. Prevent exposure to static electricity when baking. 5. Handle with care to prevent mechanical damage to package and to maintain moisture-proof condition.
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Mounting Precautions
(1) Do not apply stress to the resin at high temperature. (2) The resin part is easily scratched, so avoid friction with hard materials. (3) When installing the assembly board in equipment, ensure that this product does not come into contact with other components. (4) Expansion of the resin generated by the heat of reflow may alter the optical characteristics of this device. Please take into account changes in luminous intensity during the design phase.
Mounting Methods Reflow soldering
Temperature profile example Package surface temperature: 245(max) Perform reflow soldering no more than twice. 245 max(*) Temperature(deg) 4/sec max(*) 24/ sec max(*) 150190 max(*) 220 max(*)
60120s max(*) Time (sec)
Heating part 3010s max(*)
(*)The product is evaluated using the above reflow soldering conditions. No additional evaluation test is performed exceeding these conditions . Please perform reflow soldering under the above conditions. Perform reflow soldering no more than twice. Please perform the first reflow soldering within 48h of opening the package, with reference to the above temperature profile. Second reflow soldering: Second reflow soldering should be performed within 48h of the first reflow, under the above conditions. Storage conditions before second reflow soldering: 30, 70% RH or lower Do not mount with manual soldering. Only when the correction is needed, the manual soldering is possible only once a place. Manual soldering conditions: Temperature: less than 300 (50 W for soldering iron) Time: within 3 s
Do not perform flow soldering
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Recommended soldering pattern
1.27 Unit: mm 1.1 0.5 (3.8) 6.0
Tape Packing Specifications
Reel dimensions
15.4 13.0
2.2
180
Enlarged view of reel center 21 13 3-2.0
5
60
4
18Min
3
Unit: mm
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Tape dimensions
4.0 1.75
1.5+0.1 -0
2.00.05
0.40.05
B
5.50.05
A
A'
12.00.2
8.0 6.2
B' 5.65 B-B' A-A'
Unit: mm
Pull-out direction State of reeling in
5.4
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Packing Specification
(1)Packing quantity Reel(minimum packing quantity) Carton 400devices 5reels(2000devices)
(2)Packing format An aluminum envelope containing silica gel and the reel is deaerated and sealed.
Shock-absorbent materials are packed around the aluminum envelopes in the cartons to cus hion them. Carton specification
Label Carton dimensions (W)81mmx(L)280mmx(H)280mm
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ALLOWABLE FORWARD CURRENT IF(mA)
IF Ta
LUMINOUS INTENSITY Iv(cd) Ivcd
60
50 40 30 20 10 0 0
Iv Iv-IFIF Ta=25
(typ.)
IF(mA)
40
20
0 0
AMBIENT TEMPERATURE Ta() Ta
20
40
60
80
100
20
F
40
60
FORWARD CURRENT IF(mA) I A
RELATIVE LUMINOUS INTENSITY Iv Iv
IvIv Ta - - Ta
1.4 1.2
(typ.) 100
VF - IF
50
(typ.) 25 0 -25
FORWARD CURRENT IF(mA)
1 0.8 0.6 0.4 0.2 0 -40 -20 0 20 40 60 80 100
Ta=85
IF(mA)
10
1 1.6 1.8 2 2.2 2.4
Ta AMBIENT TEMPERATURE Ta()
FORWARD VOLTAGE (VF) VF(V)
WAVELENGTH CHARACTERISTIC (typ.) ()
1 0.8 IF=20mA Ta=25
RADIATION PATTERN
() Ta=25 (typ.)
RELATIVE INTENSITY
0.6 0.4 0.2 0 540 560 580 600 620 640 660 (nm) WAVELENGTH (nm)
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RESTRICTIONS ON PRODUCT USE
* The information contained herein is subject to change without notice.
20070701-EN
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer's own risk. * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. * GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break, cut, crush or dissolve chemically. * Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.
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